The global 3D semiconductor packaging market size was US $ 6.9 billion in 2021. The global 3D semiconductor packaging market size is forecast to reach US $ 19.7 billion by 2030, growing at a compound annual growth rate (CAGR) of 15.1% during the forecast period from 2022 to 2030.
3D semiconductor packaging is an advanced packaging technology of semiconductor chips in which layers of active electronic components are stacked together and interconnected vertically and horizontally to operate as a single device. It has various advantages over other advanced packaging technologies, such as reduced space consumption, decreased power loss, better overall performance, and increased efficiency. In addition, it makes 3D semiconductor packaging the most advanced technology in the industry. 3D semiconductor packaging provides improved performance of electrical devices operating at high frequencies, increasing its adoption in high-end applications such as dynamic random access memory (DRAMS), NAND, and others.
Factors Influencing Market Growth
Impact Analysis of COVID-19
Due to a slowdown in many end-user industries, COVID-19 has severely impacted the global 3D semiconductor packaging market. A worldwide Coronavirus outbreak has caused major delays in the implementation of the fifth-generation mobile service. In addition, a collective lag in regulatory timelines, spectrum issuance, and auctions has slowed the market's growth. Moreover, governments worldwide have postponed their spending plans until later. These issues affect consumers and businesses due to limited or unavailable network services. Furthermore, lockdowns and movement restrictions have affected the business operations of equipment manufacturers, resulting in a shortage of components.
Regional Insights
During the forecast period, Asia Pacific is forecast to remain a key market for 3D semiconductor packaging. The region offers tremendous potential for 3D semiconductor packaging. The regional market is growing due to factors including the increased production of semiconductors and the widespread use of 3D semiconductor packaging. Due to the strong presence of key market players in the region, 3D semiconductor packaging technologies are developing faster. As a result of state-backed initiatives and investments, cutting-edge packaging technologies are in high demand. Furthermore, the strong R&D pipeline for semiconductor industries in the region contributes to market growth.
Leading Competitors
The leading prominent companies profiled in the global 3D semiconductor packaging market are:
Scope of the Report
The global 3D semiconductor packaging market segmentation focuses on Technology, Industry Vertical, Material, and Region.
Segmentation based on Technology
Segmentation based on Industry Vertical
Segmentation based on Material
Segmentation based on Region
[TABLE OF CONTENTS]
1 INTRODUCTION OF GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET
1.1 OVERVIEW OF THE MARKET
1.2 SCOPE OF REPORT
1.3 ASSUMPTIONS
2 EXECUTIVE SUMMARY
3 RESEARCH METHODOLOGY
3.1 DATA MINING
3.2 VALIDATION
3.3 PRIMARY INTERVIEWS
3.4 LIST OF DATA SOURCES
4 GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET OUTLOOK
4.1 OVERVIEW
4.2 MARKET DYNAMICS
4.2.1 DRIVERS
4.2.2 RESTRAINTS
4.2.3 OPPORTUNITIES
4.3 PORTERS FIVE FORCE MODEL
4.4 VALUE CHAIN ANALYSIS
5 GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY
5.1 OVERVIEW
5.2 3D WIRE BONDED
5.3 3D THROUGH SILICON VIA
5.4 3D PACKAGE ON PACKAGE
5.5 3D FAN OUT BASED
6 GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL
6.1 OVERVIEW
6.2 ELECTRONICS
6.3 INDUSTRIAL
6.4 AUTOMOTIVE & TRANSPORT
6.5 HEALTHCARE
6.6 IT & TELECOMMUNICATION
6.7 AEROSPACE & DEFENSE
7 GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET, BY MATERIAL
7.1 OVERVIEW
7.2 ORGANIC SUBSTRATE
7.3 BONDING WIRE
7.4 LEADFRAME
7.5 ENCAPSULATION
7.6 RESINS
7.7 CERAMIC PACKAGES
7.8 DIE ATTACH MATERIAL
8 GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY
8.1 OVERVIEW
8.2 NORTH AMERICA
8.2.1 NORTH AMERICA MARKET SNAPSHOT
8.2.2 U.S.
8.2.3 CANADA
8.2.4 MEXICO
8.3 EUROPE
8.3.1 EUROPE MARKET SNAPSHOT
8.3.2 WESTERN EUROPE
8.3.2.1 THE UK
8.3.2.2 GERMANY
8.3.2.3 FRANCE
8.3.2.4 ITALY
8.3.2.5 SPAIN
8.3.2.6 REST OF WESTERN EUROPE
8.3.3 EASTERN EUROPE
8.3.3. 1 POLAND
8.3.3.2 RUSSIA
8.3.3.3 REST OF EASTERN EUROPE
8.4 ASIA PACIFIC
8.4.1 ASIA PACIFIC MARKET SNAPSHOT
8.4.2 CHINA
8.4.3 JAPAN
8.4.4 INDIA
8.4.5 AUSTRALIA & NEW ZEALAND
8.4.6 ASEAN
8.4.7 REST OF ASIA PACIFIC
8.5 MIDDLE EAST & AFRICA
8.5.1 MIDDLE EAST & AFRICA MARKET SNAPSHOT
8.5.2 UAE
8.5.3 SAUDI ARABIA
8.5.4 SOUTH AFRICA
8.5.5 REST OF MEA
8.6 SOUTH AMERICA
8.6.1 SOUTH AMERICA MARKET SNAPSHOT
8.6.2 BRAZIL
8.6.3 ARGENTINA
8.6.4 REST OF SOUTH AMERICA
9 GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET COMPETITIVE LANDSCAPE
9.1 OVERVIEW
9.2 COMPANY MARKET RANKING
9.3 KEY DEVELOPMENT STRATEGIES
10 COMPANY PROFILES
10.1 AMKOR TECHNOLOGY, INCORPORATED
10.1.1 OVERVIEW
10.1.2 FINANCIAL PERFORMANCE
10.1.3 PRODUCT OUTLOOK
10.1.4 KEY DEVELOPMENTS
10.2 JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LIMITED (JCET)
10.2.1 OVERVIEW
10.2.2 FINANCIAL PERFORMANCE
10.2.3 PRODUCT OUTLOOK
10.2.4 KEY DEVELOPMENTS
10.3 INTERNATIONAL BUSINESS MACHINES CORPORATION
10.3.1 OVERVIEW
10.3.2 FINANCIAL PERFORMANCE
10.3.3 PRODUCT OUTLOOK
10.3.4 KEY DEVELOPMENTS
10.4 QUALCOMM TECHNOLOGIES, INCORPORATED
10.4.1 OVERVIEW
10.4.2 FINANCIAL PERFORMANCE
10.4.3 PRODUCT OUTLOOK
10.4.4 KEY DEVELOPMENTS
10.5 INTEL CORPORATION
10.5.1 OVERVIEW
10.5.2 FINANCIAL PERFORMANCE
10.5.3 PRODUCT OUTLOOK
10.5.4 KEY DEVELOPMENTS
10.6 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LIMITED
10.6.1 OVERVIEW
10.6.2 FINANCIAL PERFORMANCE
10.6.3 PRODUCT OUTLOOK
10.6.4 KEY DEVELOPMENTS
10.7 STMICROELECTRONICS N.V.
10.7.1 OVERVIEW
10.7.2 FINANCIAL PERFORMANCE
10.7.3 PRODUCT OUTLOOK
10.7.4 KEY DEVELOPMENTS
10.8 SILICONWARE PRECISION INDUSTRIES CO., LIMITED (SPIL)
10.8.1 OVERVIEW
10.8.2 FINANCIAL PERFORMANCE
10.8.3 PRODUCT OUTLOOK
10.8.4 KEY DEVELOPMENTS
10.9 SÜSS MICROTEC SE
10.9.1 OVERVIEW
10.9.2 FINANCIAL PERFORMANCE
10.9.3 PRODUCT OUTLOOK
10.9.4 KEY DEVELOPMENTS
10.10 ADVANCED SEMICONDUCTOR ENGINEERING, INCORPORATED (ASE GROUP)
10.10.1 OVERVIEW
10.10.2 FINANCIAL PERFORMANCE
10.10.3 PRODUCT OUTLOOK
10.10.4 KEY DEVELOPMENTS
10.11 SONY GROUP CORPORATION
10.11.1 OVERVIEW
10.11.2 FINANCIAL PERFORMANCE
10.11.3 PRODUCT OUTLOOK
10.11.4 KEY DEVELOPMENTS
10.12 SAMSUNG ELECTRONICS CO., LIMITED
10.12.1 OVERVIEW
10.12.2 FINANCIAL PERFORMANCE
10.12.3 PRODUCT OUTLOOK
10.12.4 KEY DEVELOPMENTS
10.13 ADVANCED MICRO DEVICES, INCORPORATED
10.13.1 OVERVIEW
10.13.2 FINANCIAL PERFORMANCE
10.13.3 PRODUCT OUTLOOK
10.13.4 KEY DEVELOPMENTS
10.14 CISCO SYSTEMS, INCORPORATED
10.14.1 OVERVIEW
10.14.2 FINANCIAL PERFORMANCE
10.14.3 PRODUCT OUTLOOK
10.14.4 KEY DEVELOPMENTS
01
お客様のニーズに合わせてレポートをカスタマイズ可能
02
ベテランの市場調査員による専門的な分析
03
安全で簡単に利用できるオンライン決済方法
04
お客様のご要望に応じて、特定の章を購入することができます。
05
すべてのレポートに専門的な日本語翻訳を提供
06
包括的でわかりやすいレポートを迅速にお届けします。
07
購入後も継続的なサポートとアップデートが受けられます。
We Accept
Copyright ©2022 All rights reserved