The global dicing tapes market revenue was around US$ 1,390.2 million in 2022 and is estimated to reach US$ 2,348.7 million by 2031, growing at a compound annual growth rate (CAGR) of 6% during the forecast period from 2023 to 2031.
The dicing tape has a sticky backing that maintains the wafer on a slim sheet metal frame. The dicing tape has various properties depending on the dicing application. UV curable tapes are utilized for smaller sizes and non-UV dicing tape for larger die sizes.
Market Driving Factors
Increasing use in semiconductor applications boosts market expansion. This is because dicing tapes are utilized in a broad range of applications, such as dicing for wafers, glasses, package substrates, and ceramics. In addition, these are surging gaining preference among semiconductor manufacturers owing to easy chip removal from wafers after the dicing procedure.
The surging demand for aesthetically thin electronics has resulted in lighter and more delicate components. Such processes are driving the market growth. Wafer component processing companies are surging inclining toward materials that have high additive and effect strength and durability that decrease when exposed to ultraviolet light. As a result, the makers of dicing tapes are concentrating on product innovation to incorporate films that are flexible and expandable in addition to trying to meet the unique needs of end users.
Lack of labor and raw materials are expected to inhibit the market growth.
Regional Analysis
Asia Pacific dominated the market in terms of shares and is predicted to continue its dominance. This can be majorly attributed to the existence of a pure variety of electronic and electrical manufacturers within the region, which accounted for the increased demand in the region. Furthermore, this region witnessed innovatory progress in producing electronic devices. Moreover, China has emerged as an excellent marketplace for dicing tape due to the surged production of consumer durable electronic goods (CDEG),
North America is estimated to dominate the market in terms of the growth rate. This growth is owing to the semiconductor manufacturing prowess and technological prowess. Furthermore, the existence of key players like artificial intelligence technology and an emphasis on advanced technologies contribute to the market growth. Moreover, strategic collaborations and partnerships between manufacturers and semiconductor firms foster innovation, positioning this region as a main player in the international landscape.
Europe dominates the market in terms of revenue. This is due to the well-established semiconductor manufacturing infrastructure in the region. Additionally, companies such as Lintec Corporation capitalize on the region's robust emphasis on research and development, creating high-quality dicing tapes.
Segmentation Insights
In terms of product insight, the UV curable segment dominates the market in terms of shares. This is because the adhesive strength of UV-curable dicing tapes is stronger than that of non-UV curable tapes. Static layers in UV dicing tapes reduce negative charges and shield wafers from damage, which makes them highly sought-after compared to their counterparts.
Prominent Companies
Segmentation Outline
The global dicing tapes market segmentation focuses on Thickness, Product, Material, and Region.
By Thickness
By Product
By Material
By Region
[TABLE OF CONTENTS]
1 INTRODUCTION OF GLOBAL DICING TAPES MARKET
1.1 OVERVIEW OF THE MARKET
1.2 SCOPE OF REPORT
1.3 ASSUMPTIONS
2 EXECUTIVE SUMMARY: DICING TAPES MARKET
3 RESEARCH METHODOLOGY
3.1 DATA MINING
3.2 VALIDATION
3.3 PRIMARY INTERVIEWS
3.4 LIST OF DATA SOURCES
3.5 ANALYST TOOLS AND MODELS
4 GLOBAL DICING TAPES MARKET OUTLOOK
4.1 OVERVIEW
4.2 MARKET DYNAMICS AND TRENDS
4.2.1 DRIVERS
4.2.2 RESTRAINTS
4.2.3 OPPORTUNITIES
4.3 PORTERS FIVE FORCE ANALYSIS
4.4 VALUE CHAIN ANALYSIS
4.5 MARKET GROWTH AND OUTLOOK
4.5.1 PRICE TREND ANALYSIS
4.5.2 OPPORTUNITY SHARE
5 GLOBAL DICING TAPES MARKET, BY THICKNESS
5.1 OVERVIEW
5.2 BELOW 85 MICRON
5.3 86-125 MICRON
5.4 126-150 MICRON
5.5 ABOVE 150 MICRON
6 GLOBAL DICING TAPES MARKET, BY PRODUCT
6.1 OVERVIEW
6.2 UV CURABLE
6.3 NON-UV CURABLE
7 GLOBAL DICING TAPES MARKET, BY MATERIAL
7.1 OVERVIEW
7.2 POLYETHYLENE TEREPHTHALATE
7.3 POLYOLEFIN
7.4 POLYVINYL CHLORIDE
8 GLOBAL DICING TAPES MARKET, BY GEOGRAPHY
8.1 OVERVIEW
8.2 NORTH AMERICA
8.2.1 NORTH AMERICA MARKET SNAPSHOT
8.2.2 U.S.
8.2.3 CANADA
8.2.4 MEXICO
8.3 EUROPE
8.3.1 EUROPE MARKET SNAPSHOT
8.3.2 WESTERN EUROPE
8.3.2.1 THE UK
8.3.2.2 GERMANY
8.3.2.3 FRANCE
8.3.2.4 ITALY
8.3.2.5 SPAIN
8.3.2.6 REST OF WESTERN EUROPE
8.3.3 EASTERN EUROPE
8.3.3.1 POLAND
8.3.3.2 RUSSIA
8.3.3.3 REST OF EASTERN EUROPE
8.4 ASIA PACIFIC
8.4.1 ASIA PACIFIC MARKET SNAPSHOT
8.4.2 CHINA
8.4.3 JAPAN
8.4.4 INDIA
8.4.5 AUSTRALIA & NEW ZEALAND
8.4.6 ASEAN
8.4.7 REST OF ASIA PACIFIC
8.5 MIDDLE EAST & AFRICA
8.5.1 MIDDLE EAST & AFRICA MARKET SNAPSHOT
8.5.2 UAE
8.5.3 SAUDI ARABIA
8.5.4 SOUTH AFRICA
8.5.5 REST OF MEA
8.6 SOUTH AMERICA
8.6.1 SOUTH AMERICA MARKET SNAPSHOT
8.6.2 BRAZIL
8.6.3 ARGENTINA
8.6.4 REST OF SOUTH AMERICA
9 GLOBAL DICING TAPES MARKET COMPETITIVE LANDSCAPE
9.1 OVERVIEW
9.2 COMPANY MARKET RANKING
9.3 KEY DEVELOPMENT STRATEGIES
9.4 COMPETITIVE DASHBOARD
9.5 PRODUCT MAPPING
9.6 TOP PLAYER POSITIONING, 2022
9.7 COMPETITIVE HEATMAP
9.8 TOP WINNING STRATEGIES
10 COMPANY PROFILES
10.1 NIPPON PULSE MOTOR TAIWAN
10.1.1 OVERVIEW
10.1.2 FINANCIAL PERFORMANCE
10.1.3 PRODUCT OUTLOOK
10.1.4 KEY DEVELOPMENTS
10.1.5 KEY STRATEGIC MOVES AND DEVELOPMENTS
10.2 ULTRON SYSTEMS INC.
10.2.1 OVERVIEW
10.2.2 FINANCIAL PERFORMANCE
10.2.3 PRODUCT OUTLOOK
10.2.4 KEY DEVELOPMENTS
10.2.5 KEY STRATEGIC MOVES AND DEVELOPMENTS
10.3 NITTO DENKO CORP.
10.3.1 OVERVIEW
10.3.2 FINANCIAL PERFORMANCE
10.3.3 PRODUCT OUTLOOK
10.3.4 KEY DEVELOPMENTS
10.3.5 KEY STRATEGIC MOVES AND DEVELOPMENTS
10.4 SOLAR PLUS COMPANY
10.4.1 OVERVIEW
10.4.2 FINANCIAL PERFORMANCE
10.4.3 PRODUCT OUTLOOK
10.4.4 KEY DEVELOPMENTS
10.4.5 KEY STRATEGIC MOVES AND DEVELOPMENTS
10.5 DAEST COATING INDIA PVT LTD.
10.5.1 OVERVIEW
10.5.2 FINANCIAL PERFORMANCE
10.5.3 PRODUCT OUTLOOK
10.5.4 KEY DEVELOPMENTS
10.5.5 KEY STRATEGIC MOVES AND DEVELOPMENTS
10.6 LOAD POINT
10.6.1 OVERVIEW
10.6.2 FINANCIAL PERFORMANCE
10.6.3 PRODUCT OUTLOOK
10.6.4 KEY DEVELOPMENTS
10.6.5 KEY STRATEGIC MOVES AND DEVELOPMENTS
10.7 AI TECHNOLOGY INC.
10.7.1 OVERVIEW
10.7.2 FINANCIAL PERFORMANCE
10.7.3 PRODUCT OUTLOOK
10.7.4 KEY DEVELOPMENTS
10.7.5 KEY STRATEGIC MOVES AND DEVELOPMENTS
10.8 LINTEC CORPORATION
10.8.1 OVERVIEW
10.8.2 FINANCIAL PERFORMANCE
10.8.3 PRODUCT OUTLOOK
10.8.4 KEY DEVELOPMENTS
10.8.5 KEY STRATEGIC MOVES AND DEVELOPMENTS
10.9 DENKA COMPANY LIMITED
10.9.1 OVERVIEW
10.9.2 FINANCIAL PERFORMANCE
10.9.3 PRODUCT OUTLOOK
10.9.4 KEY DEVELOPMENTS
10.9.5 KEY STRATEGIC MOVES AND DEVELOPMENTS
10.10 QES GROUP BERHAD
10.10.1 OVERVIEW
10.10.2 FINANCIAL PERFORMANCE
10.10.3 PRODUCT OUTLOOK
10.10.4 KEY DEVELOPMENTS
10.10.5 KEY STRATEGIC MOVES AND DEVELOPMENTS
10.11 3M COMPANY
10.11.1 OVERVIEW
10.11.2 FINANCIAL PERFORMANCE
10.11.3 PRODUCT OUTLOOK
10.11.4 KEY DEVELOPMENTS
10.11.5 KEY STRATEGIC MOVES AND DEVELOPMENTS
10.12 SUMITOMO BAKELITE CO. LTD
10.12.1 OVERVIEW
10.12.2 FINANCIAL PERFORMANCE
10.12.3 PRODUCT OUTLOOK
10.12.4 KEY DEVELOPMENTS
10.12.5 KEY STRATEGIC MOVES AND DEVELOPMENTS
10.13 MITSUI CHEMICALS INC.
10.13.1 OVERVIEW
10.13.2 FINANCIAL PERFORMANCE
10.13.3 PRODUCT OUTLOOK
10.13.4 KEY DEVELOPMENTS
10.13.5 KEY STRATEGIC MOVES AND DEVELOPMENTS
10.14 PANTECH TAPE CO. LTD
10.14.1 OVERVIEW
10.14.2 FINANCIAL PERFORMANCE
10.14.3 PRODUCT OUTLOOK
10.14.4 KEY DEVELOPMENTS
10.14.5 KEY STRATEGIC MOVES AND DEVELOPMENTS
10.15 HITACHI CHEMICAL COMPANY LTD
10.15.1 OVERVIEW
10.15.2 FINANCIAL PERFORMANCE
10.15.3 PRODUCT OUTLOOK
10.15.4 KEY DEVELOPMENTS
10.15.5 KEY STRATEGIC MOVES AND DEVELOPMENTS
10.16 FURUKAWA ELECTRIC CO. LTD
10.16.1 OVERVIEW
10.16.2 FINANCIAL PERFORMANCE
10.16.3 PRODUCT OUTLOOK
10.16.4 KEY DEVELOPMENTS
10.16.5 KEY STRATEGIC MOVES AND DEVELOPMENTS
10.17 SHENZHEN XINST TECHNOLOGY CO., LTD
10.17.1 OVERVIEW
10.17.2 FINANCIAL PERFORMANCE
10.17.3 PRODUCT OUTLOOK
10.17.4 KEY DEVELOPMENTS
10.17.5 KEY STRATEGIC MOVES AND DEVELOPMENTS
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