The global chemical mechanical planarization market revenue was around US$ 5.4 billion in 2022 and is estimated to reach US$ 8.59 billion by 2031, growing at a compound annual growth rate (CAGR) of 5.3% during the forecast period from 2023 to 2031.
Chemical mechanical planarization is the technique for removing topography from metal, silicon oxide, and polysilicon surfaces. It’s a hybrid of chemical etching and free abrasive polishing that is used to smooth surfaces utilizing a mix of mechanical and chemical forces. The technique is based on the idea that higher locations on the surface should experience greater pad pressure than lower points to enhance removal rates and achieve planarization.
Market Driving Factors
The rapid increase in sales and production of semiconductors and increasing adoption of CMP in the semiconductor industry is propelling the market growth. According to the Semiconductor Sector Association (SIA), the worldwide semiconductor sector generated about US$ 574.1 billion in sales in 2022.
The commercialization of 5G mobile communications systems, which surge the need for mobile terminals/data centers, and the growth of high-performance semiconductors due to technological innovation in fields such as autonomous/ artificial intelligence boost the market. As a result, the CMP key players are estimated to increase as the semiconductor memories shift from 2D to 3D structures, and the sophistication of the transistor structures, including finely-pitched semiconductor logic circuits, increases.
The high price and complexity involved in manufacturing hamper the market growth.
Regional Analysis
Asia-Pacific dominates the market during the forecast period. This is due to the increasing demand for electronic and semiconductor products. Furthermore, increasing demand for high-quality polished wafers in the electronics and semiconductor sectors. In addition, the requirement for CMP materials and tools is set to increase as China keeps making investments in its local semiconductor company. Therefore, this factor creates opportunities for both market participants in the region.
Segmentation Insights
Type Insight
The CMP consumables segment is estimated to dominate the market. This is due to the enormous volume of sophisticated semiconductor device manufacture. Producers must use material polishing methods capable of producing complicated designs in smaller footprints. As a result, consumables adaptability to have severe control over slurry quality increases. Additionally, the usage of expensive materials such as polyphenylene sulfide and polyether ether ketone in several formulations to oppose chipping, ensure extended wear life, and others have emerged as an important element fueling the market growth.
Application Insight
The integrated circuits segment is the fastest growing in the market during the projection period. This is due to the increasing demand for these as digitization is on the rise. CMP increased in prominence for serving IC (Integrated Circuit) producers' applications owing to the surge in the use of silicon materials and a transformation toward serving needs linked to tiny devices. Therefore, some of the main factors boosting the need for chemical mechanical planarization processes throughout integrated circuits manufacturing techniques are the surge in penetration of smartphones and the increasing investment in making semiconductor fabrication units.
Prominent Companies
Segmentation Outline
The global chemical mechanical planarization market segmentation focuses on Type, Technology, Application, and Region.
By Type
By Technology
By Application
By Region
[TABLE OF CONTENTS]
1 INTRODUCTION OF GLOBAL CHEMICAL MECHANICAL PLANARIZATION MARKET
1.1 OVERVIEW OF THE MARKET
1.2 SCOPE OF REPORT
1.3 ASSUMPTIONS
2 EXECUTIVE SUMMARY: CHEMICAL MECHANICAL PLANARIZATION MARKET
3 RESEARCH METHODOLOGY
3.1 DATA MINING
3.2 VALIDATION
3.3 PRIMARY INTERVIEWS
3.4 LIST OF DATA SOURCES
3.5 ANALYST TOOLS AND MODELS
4 GLOBAL CHEMICAL MECHANICAL PLANARIZATION MARKET OUTLOOK
4.1 OVERVIEW
4.2 MARKET DYNAMICS AND TRENDS
4.2.1 DRIVERS
4.2.2 RESTRAINTS
4.2.3 OPPORTUNITIES
4.3 PORTERS FIVE FORCE ANALYSIS
4.4 VALUE CHAIN ANALYSIS
4.5 MARKET GROWTH AND OUTLOOK
4.5.1 PRICE TREND ANALYSIS
4.5.2 OPPORTUNITY SHARE
5 GLOBAL CHEMICAL MECHANICAL PLANARIZATION MARKET, BY TYPE
5.1 OVERVIEW
5.2 CMP CONSUMABLE
5.3 CMP EQUIPMENT
6 GLOBAL CHEMICAL MECHANICAL PLANARIZATION MARKET, BY TECHNOLOGY
6.1 OVERVIEW
6.2 LEADING EDGE
6.3 EMERGING
7 GLOBAL CHEMICAL MECHANICAL PLANARIZATION MARKET, BY APPLICATION
7.1 OVERVIEW
7.2 INTEGRATED CIRCUITS
7.3 MEMS AND NEMS
7.4 COMPOUND SEMICONDUCTORS
7.5 OPTICS
8 GLOBAL CHEMICAL MECHANICAL PLANARIZATION MARKET, BY GEOGRAPHY
8.1 OVERVIEW
8.2 NORTH AMERICA
8.2.1 NORTH AMERICA MARKET SNAPSHOT
8.2.2 U.S.
8.2.3 CANADA
8.2.4 MEXICO
8.3 EUROPE
8.3.1 EUROPE MARKET SNAPSHOT
8.3.2 WESTERN EUROPE
8.3.2.1 THE UK
8.3.2.2 GERMANY
8.3.2.3 FRANCE
8.3.2.4 ITALY
8.3.2.5 SPAIN
8.3.2.6 REST OF WESTERN EUROPE
8.3.3 EASTERN EUROPE
8.3.3. 1 POLAND
8.3.3.2 RUSSIA
8.3.3.3 REST OF EASTERN EUROPE
8.4 ASIA PACIFIC
8.4.1 ASIA PACIFIC MARKET SNAPSHOT
8.4.2 CHINA
8.4.3 JAPAN
8.4.4 INDIA
8.4.5 AUSTRALIA & NEW ZEALAND
8.4.6 ASEAN
8.4.7 REST OF ASIA PACIFIC
8.5 MIDDLE EAST & AFRICA
8.5.1 MIDDLE EAST & AFRICA MARKET SNAPSHOT
8.5.2 UAE
8.5.3 SAUDI ARABIA
8.5.4 SOUTH AFRICA
8.5.5 REST OF MEA
8.6 SOUTH AMERICA
8.6.1 SOUTH AMERICA MARKET SNAPSHOT
8.6.2 BRAZIL
8.6.3 ARGENTINA
8.6.4 REST OF SOUTH AMERICA
9 GLOBAL CHEMICAL MECHANICAL PLANARIZATION MARKET COMPETITIVE LANDSCAPE
9.1 OVERVIEW
9.2 COMPANY MARKET RANKING
9.3 KEY DEVELOPMENT STRATEGIES
9.4 COMPETITIVE DASHBOARD
9.5 PRODUCT MAPPING
9.6 TOP PLAYER POSITIONING, 2022
9.7 COMPETITIVE HEATMAP
9.8 TOP WINNING STRATEGIES
10 COMPANY PROFILES
10.1 APPLIED MATERIALS INC
10.1.1 OVERVIEW
10.1.2 FINANCIAL PERFORMANCE
10.1.3 PRODUCT OUTLOOK
10.1.4 KEY DEVELOPMENTS
10.1.5 KEY STRATEGIC MOVES AND DEVELOPMENTS
10.2 EBARA CORPORATION
10.2.1 OVERVIEW
10.2.2 FINANCIAL PERFORMANCE
10.2.3 PRODUCT OUTLOOK
10.2.4 KEY DEVELOPMENTS
10.2.5 KEY STRATEGIC MOVES AND DEVELOPMENTS
10.3 LAPMASTER WOLTERS GMBH
10.3.1 OVERVIEW
10.3.2 FINANCIAL PERFORMANCE
10.3.3 PRODUCT OUTLOOK
10.3.4 KEY DEVELOPMENTS
10.3.5 KEY STRATEGIC MOVES AND DEVELOPMENTS
10.4 LAM RESEARCH CORPORATION
10.4.1 OVERVIEW
10.4.2 FINANCIAL PERFORMANCE
10.4.3 PRODUCT OUTLOOK
10.4.4 KEY DEVELOPMENTS
10.4.5 KEY STRATEGIC MOVES AND DEVELOPMENTS
10.5 OKAMOTO MACHINE TOOL WORKS, LTD
10.5.1 OVERVIEW
10.5.2 FINANCIAL PERFORMANCE
10.5.3 PRODUCT OUTLOOK
10.5.4 KEY DEVELOPMENTS
10.5.5 KEY STRATEGIC MOVES AND DEVELOPMENTS
10.6 CABOT MICROELECTRONICS CORPORATION
10.6.1 OVERVIEW
10.6.2 FINANCIAL PERFORMANCE
10.6.3 PRODUCT OUTLOOK
10.6.4 KEY DEVELOPMENTS
10.6.5 KEY STRATEGIC MOVES AND DEVELOPMENTS
10.7 DOW ELECTRONIC MATERIALS
10.7.1 OVERVIEW
10.7.2 FINANCIAL PERFORMANCE
10.7.3 PRODUCT OUTLOOK
10.7.4 KEY DEVELOPMENTS
10.7.5 KEY STRATEGIC MOVES AND DEVELOPMENTS
10.8 FUJIMI INCORPORATION
10.8.1 OVERVIEW
10.8.2 FINANCIAL PERFORMANCE
10.8.3 PRODUCT OUTLOOK
10.8.4 KEY DEVELOPMENTS
10.8.5 KEY STRATEGIC MOVES AND DEVELOPMENTS
10.9 HITACHI CHEMICAL COMPANY, LTD.
10.9.1 OVERVIEW
10.9.2 FINANCIAL PERFORMANCE
10.9.3 PRODUCT OUTLOOK
10.9.4 KEY DEVELOPMENTS
10.9.5 KEY STRATEGIC MOVES AND DEVELOPMENTS
10.10 AIR PRODUCTS AND CHEMICALS, INC.
10.10.1 OVERVIEW
10.10.2 FINANCIAL PERFORMANCE
10.10.3 PRODUCT OUTLOOK
10.10.4 KEY DEVELOPMENTS
10.10.5 KEY STRATEGIC MOVES AND DEVELOPMENTS
10.11 CMC MATERIALS
10.11.1 OVERVIEW
10.11.2 FINANCIAL PERFORMANCE
10.11.3 PRODUCT OUTLOOK
10.11.4 KEY DEVELOPMENTS
10.11.5 KEY STRATEGIC MOVES AND DEVELOPMENTS
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